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| SUPER DRY, is the 1st auto-electronic desiccator that can maintain the ultra low humidity under 5%RH in the world, successfully marketing our products since 1974. SUPER DRY is designed to eliminate Moisture Sensitive Device (MSD) defects such as; micro-cracks, voids, depanaling and delamination etc. Currently more than 1400 company users including NASA, Intel etc over 26 countries have selected Totech’s auto-electronic desiccator to protect their valuable inventory. |
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| SUPER DRY was the first dry cabinet introduced in many Japanese Semiconductor
factories, SUPER DRY is widely used in various European and American factories.
With SUPER DRY, the moisture related defects of IC packages and Printed
Circuit Boards (PCBs) can be effectively and easily reduced or prevented.
And with the introduction of lead-free processes the proper handling and
care of MSD will become even more critical. |
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Storage of SMD packages after their removal from the
moisture barrier bags
Storage of PCB (equipped on both sides) during the mounting process
Storage of Printed Circuit Board during the examination process |
1) IC packages
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Ultra-low humidity storage and handling of unsealed CSP, BGA, QFP etc
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Ultra-low humidity storage of PLD during the programming process
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Recommended Model
[Hyper series] [02 series]
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2) PCBs
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Dehumidification and moisture-proofing of Organic Thin Layered Boards, Printed Wiring Boards
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Ultra-low humidity handling of Pattern Film during its production process
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Recommended Model
[02 Series] |
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3) Silicon Wafer
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Anti-oxidation
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High quality control with dust-proofing
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Recommended Model
[Hyper series] |
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4) Ceramics
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Ceramic Board, Ceramics Condenser and other Ceramics-related materials (powder)
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Recommended Model
[Hyper series] |
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5) Liquid Crystal Glass (LCG) Board
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Dehydration under the ambient temperature after polishing
(Maintaining balanced desiccating and prevention of discharging and adhesion of chemicals)
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Recommended Model
[Hyper series] |
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6) Optical Fiber, CCD etc
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Ultra-low humidity storage of micro-lens
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Long term dehumidification and moisture-proof storage of devices which are not suitable for high temperature baking
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Recommended Model
[Hyper series]
[02 series] |
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7) Crystal Resonator
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Ultra-low humidity storage of Crystals, Electrode Materials and Binding Materials
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Recommended Model
[Hyper series]
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8) Other Electric Components
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Anti-oxidation of lead frame and bonding wire
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Recommended Model
[02 series]
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| <- Goto TOP |
| IPC/JEDEC has concluded the following joint standard for
the handling SMD. |
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Moisture
Sensitivity
Level 2-4 |
Below
10% RHstorage is necessary. After the removal from a moisture
barrier bag,the floor life of dry packages which is exposed under
the environment not exceeding 30ºC and 60%RH can be reset, if they
are placed in a dry box not greater than 10%RH for a minimum desiccating
period of 5X the expose time. |
Moisture
Sensitivity
Level 5-5a |
Below
5% RHstorage is required. A minimum desiccating period of
10X the exposure time is necessary to dry the IC packages which
are exposed not exceeding 30ºC and 60%RH after removing from a moisture
barrier bag enough to reset their floor life. |
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| Reference:
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The floor life
of IC packages after removing from the moisture barrier bag |
Level
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Floor Life* |
| 1 |
unlimited at 30ºC / 85%RH |
| 2 |
1 year |
| 2a |
4 weeks |
| 3 |
168 hrs |
| 4 |
72 hrs |
| 5 |
48 hrs |
| 5a |
24 hrs |
| 6 |
Baking is necessary |
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*After removal from a moisture barrier bag, the allowable time of IC packages
exposed to a factory ambient not exceeding 30ºCand 60%RH
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| Once parts have been removed from their moisture barrier bags and placed safety in SUPER DRY defects at the end of the line will be reduced. |
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Easy Operation: SUPER DRY is an electric
appliance, so just plug it in before using.
Auto-recycling: Absorbed moisture is discharded as vapor without
casing any problems of water leakage.
Cost-saving: The maintencance fee of SUPER DRY is only 1/20 compared
with N2gas storage box.
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| Products |
Humidity
Setting and their Main features |
| Hyper
series |
1-50%RH (Drying Unit x 2) |
| Recommended whenever
doors will be opened once an hour or once 2 hours. |
| 02
series |
2-50%RH (Drying Unit x 1) |
| Suitable for long term
storage of MSD with infrequent door opening. |
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| <- Goto TOP |
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Before reflow |
Reflow process |
IC packages
BGA
CSP
QFP
TQFP
etc
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Normal Storage |
| Moisture in the air is absorbed in the package. |
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| Delamination by heating at the first stage. |
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As process goes on, more pressure by heating will make the delamination become bigger. |
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The pressure from delamination makes cracks in the packages. |
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| Cracks do not make any defects at first, however it gradually corrodes the IC chip. |
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| SUPER DRY Storage |
| SUPER DRY can dehumidify micro-moisture absorbed in the package. |
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| JEDEC/IPC suggests the storage of device should be under 10%RH. |
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| SUPER DRY ensures high quality control for production with it ultra low humidity control. |
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| HYPER series are recommended for the storage of IC packages during its production process.
For faster dehumidification for taping devices, Easy Control series are recommended. |
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