World's No.1 Dry Box

 

Tech Infomations

 

IPC/JEDEC Standard (J-STD-033A)

IPC/JEDEC has concluded the following joint standard for the handling SMD.

Moisture Sensitivity Level 2-4 Below 10% RH storage is necessary. After the removal from a moisture barrier bag,the floor life of dry packages which is exposed under the environment not exceeding 30ºC and 60%RH can be reset, if they are placed in a dry box not greater than 10%RH for a minimum desiccating period of 5X the expose time.
Moisture Sensitivity Level 5-5a Below 5% RH storage is required. A minimum desiccating period of 10X the exposure time is necessary to dry the IC packages which are exposed not exceeding 30ºC and 60%RH after removing from a moisture barrier bag enough to reset their floor life.

Reference: The floor life of IC packages after removing from the moisture barrier bag

LevelFloor Life*
1 unlimited at 30ºC / 85%RH
2 1 year
2a 4 weeks
3 168 hrs
4 72 hrs
5 48 hrs
5a 24 hrs
6 Baking is necessary

*After removal from a moisture barrier bag, the allowable time of IC packages exposed to a factory ambient not exceeding 30ºCand 60%RH

SUPER DRY is the only choice for your ultra-low humidity storage

Once parts have been removed from their moisture barrier bags and placed safety in SUPER DRY defects at the end of the line will be reduced.

Humidity Control Paradigm

Prefect ultra-low RH storage in SUPER DRY

Easy Operation: SUPER DRY is an electric appliance, so just plug it in before using. Auto-recycling: Absorbed moisture is discharded as vapor without casing any problems of water leakage. Cost-saving: The maintencance fee of SUPER DRY is only 1/20 compared with N2gas storage box.

Products Humidity Setting and their Main features
Hyper series 1-50%RH (Drying Unit x 2)
Recommended whenever doors will be opened once an hour or once 2 hours.
02 series 2-50%RH (Drying Unit x 1)
Suitable for long term storage of MSD with infrequent door opening.

The mechanism of micro-crack in Intergrated Circuits (ICs) packages

  Before reflow Reflow process
IC packages
IC packages
BGA CSP QFP TQFP etc
Normal Storage

Moisture in the air is absorbed in the package.

IC mechanism

Delamination by heating at the first stage.

IC mechanism

As process goes on, more pressure by heating will make the delamination become bigger.

IC mechanism

The pressure from delamination makes cracks in the packages.

IC mechanism

Cracks do not make any defects at first, however it gradually corrodes the IC chip.

SUPER DRY Storage

SUPER DRY can dehumidify micro-moisture absorbed in the package.

JEDEC/IPC suggests the storage of device should be under 10%RH.

SUPER DRY ensures high quality control for production with it ultra low humidity control.

HYPER series are recommended for the storage of IC packages during its production process. For faster dehumidification for taping devices, Easy Control series are recommended.

Strategy against Lead-free

Moisture trapped inside MSDs will cause defects during the reflow process. The introduction of a lead free process will only aggravate this reality. The data below shows that the vapor pressure becomes greater and greater with increasing reflow temperatures.

This vapor pressure can cause micro-cracking and delamination inside MSDs and in the end will result in failures, both at test and latent defects in the fields. With ultra-low humidity storage in SUPER DRY, the moisture inside IC packages can be dehumidified to nearly 0% preventing defects which can be caused by moisture absorption.

Specification is subject to change without prior notice for better quality.

Solutions

Storage of SMD packages after their removal from the moisture barrier bags. Storage of PCB (equipped on both sides) during the mounting process. Storage of Printed Circuit Board during the examination process.

  1. 1) IC packages

    • Ultra-low humidity storage and handling of unsealed CSP, BGA, QFP etc
    • Ultra-low humidity storage of PLD during the programming process

    Recommended Model

    IC packages
  2. 2) PCBs

    • Dehumidification and moisture-proofing of Organic Thin Layered Boards, Printed Wiring Boards
    • Ultra-low humidity handling of Pattern Film during its production process

    Recommended Model

    PCBs
  3. 3) Silicon Wafer

    • Anti-oxidation
    • High quality control with dust-proofing

    Recommended Model

    Silicon Wafer
  4. 4) Ceramics

    • Ceramic Board, Ceramics Condenser and other Ceramics-related materials (powder)

    Recommended Model

    Ceramics
  5. 5) Liquid Crystal Glass (LCG) Board

    • Dehydration under the ambient temperature after polishing
      (Maintaining balanced desiccating and prevention of discharging and adhesion of chemicals)

    Recommended Model

    Liquid Crystal Glass Board
  6. 6) Optical Fiber, CCD etc

    • Ultra-low humidity storage of micro-lens
    • Long term dehumidification and moisture-proof storage of devices which are not suitable for high temperature baking

    Recommended Model

    Optical Fiber, CCD
  7. 7) Crystal Resonator

    • Ultra-low humidity storage of Crystals, Electrode Materials and Binding Materials

    Recommended Model

    Crystal Resonator
  8. 8) Other Electric Components

    • Anti-oxidation of lead frame and bonding wire

    Recommended Model